Exynos 2600’s Heat Pass Block Could End Smartphone Cooling Fans

Samsung’s upcoming Exynos 2600 introduces Heat Pass Block (HPB), a new cooling solution designed to lower thermal resistance and improve heat dissipation by up to 20%.

With chipsets pushing higher clock speeds — the Snapdragon 8 Elite Gen 6 Pro rumored at 5.00GHz and the Snapdragon 8 Elite Gen 5 for Galaxy expected to reach 4.74GHz — heat output continues to rise.

Brands like REDMAGIC have added built-in cooling fans to manage temperatures, but they can be noisy and still aren’t a perfect solution.

HPB places a heatsink directly on the chipset die, helping transfer heat more efficiently even with DRAM stacked above it. If it delivers as promised, high-performance phones may finally move away from custom fans.

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