🇨🇳📝 China’s Memory Chip Push Targets Domestic Equipment To Cut Foreign Dependence

China’s biggest DRAM memory chip producer ChangXin Memory Technologies (CXMT) plans to invest $5.2B to expand production and develop more advanced chips, with a large share of the spending expected to go toward Chinese-made semiconductor equipment.

According to a company filing, CXMT will allocate $3.6B for a new technology research and development project and another $1.6B for the second phase of a wafer testing base. Around $3.3B of the R&D budget is planned for equipment purchases.

A person familiar with CXMT’s supply chain told the South China Morning Post that the company has set an “aggressive” target for using domestic equipment, although CXMT has not publicly disclosed a specific localization percentage.

The push comes as China’s semiconductor industry works to reduce reliance on foreign suppliers for the machines needed to produce advanced chips. The hardest equipment to replace remains in areas such as etching, deposition, cleaning and inspection, where companies from the US, Japan and the Netherlands still hold strong positions.

CXMT’s expansion is aimed at narrowing the gap with global memory leaders Samsung, SK Hynix and Micron. The company has already moved beyond older DDR4 and LPDDR4X products into newer DDR5 and LPDDR5 memory, while its fifth-generation G5 manufacturing platform has entered mass production.

Morgan Stanley estimates CXMT’s monthly DRAM production capacity could reach 500,000 wafers by 2028, compared with 180,000 at the end of 2025. The company is also expanding internal testing capacity to reduce dependence on external packaging and testing providers.

The development shows the next stage of China’s semiconductor strategy: increasing production while building a more independent industrial chain. A larger domestic equipment base would reduce exposure to export controls and make it harder for foreign suppliers to limit China’s access to critical chipmaking technology.

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