[Celebration] VoidChain Unveiled at CDDJAP 2026 Summer Batch Kickoff Summit

[Fireworks] Event Overview: The CDDJAP 2026 Summer Batch Kickoff Summit was held in Hong Kong, bringing together over 300 industry leaders from the AI, Web3, RWA, and cross-border payment sectors. VoidChain's founder was invited to attend the summit, where he presented the "Information World Trilemma" concept, delivered a comprehensive technical solution addressing the trust and security challenges of AI Agent interactions, and proposed that Web3 must be grounded in real-world industry applications. Leveraging Hong Kong's strengths as an innovation hub, VoidChain aims to empower commercial applications such as RWA, cross-border payments, and AI Agent collaboration, jointly building a Hong Kong-Asia digital innovation ecosystem.

Media Coverage Links:

Xiou Wang: https://xiouwang.cn/webnews/11395.html

Huashang Information: https://cn.aipiou.com/news/20260829102555.html

CBERI Brand News: https://prize.cberi.com/brand/5677.html

AEXNEWS: https://www.aexnews.com/zh/article/voidchaincddjap-2026-6a92433149c67

AI Lianbo Net: https://ailianbo.cn/5402.html

RCEO Net: https://www.rceo.cn/inews/article.php?id=5680

Innovation Daily: https://news.asia-brand.com/article.php?id=5867

Jin'ou Finance: https://money.binubi.com/20260829102555.html

Huashang Brand Net: https://news.pceo.cn/2623.html