Iphone 18 Pro Motherboard Leaks
- no longer a dual layer motherboard sandwiching the SoC
- A20 Pro chip now adopts WMCM packaging, moves the DRAM to the side of the package => better thermal dissipation
- LPDD5X 96-bit memory
- die size roughly the same/beefed up NPU
Source: Leaked documents from iPhone manufacturer TATA weighing 630GB available on dark web.
Analysis by Twitter user - ldt
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