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📰 Qualcomm Patching Linux For Hardware Thermal Binning To Benefit Snapdragon X Laptops

A new patch series sent out from Qualcomm that aims to help at least the Snapdragon X series laptops is hardware-binned trip point support. Some Qualcomm SoCs are available in different multiple thermal/package bins with different junction temperature limits but otherwise being the same silicon. The new Linux patches are working to properly convey that information around the thermal limits for a given piece of silicon...

🔗 Source: https://www.phoronix.com/news/Qualcomm-HW-BIn-Trip-Point

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https://phoronix.com/news/Qualcomm-HW-BIn-Trip-Point
Phoronix Qualcomm Patching Linux For Hardware Thermal Binning To Benefit Snapdragon X Laptops A new patch series sent out from Qualcomm that aims to help at least the Snapdragon X series laptops is hardware-binned trip point support
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