TSMC: 3nm EUV Development Progress Going Well, Early Customers Engaged via Anandtech

> Meanwhile, it is safe to say that that TSMC’s 3 nm node will use both deep ultraviolet (DUV) and extreme ultraviolet (EUV) lithography equipment. Since TSMC’s N5 uses up to 14 EUV layers, it is likely that N3 will go even higher in the amount of layers employed. The world’s largest contract maker of semiconductors also seems to be quite happy with its EUV progress and considers the technology important for its future.

Жду не дождусь узнать, куда вырулит прогресс после 2024 года!